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Power Management IC Series for Automotive Body Control
LED Driver
BD8105FV
No.09039EBT01
Description The BD8105FV is a serial parallel control LED driver with 35V input voltage rating. Responding to the 3-line serial data, it turns the 12ch open drain output on/off. Due to its compact size, it is optimal for small spaces.
Features 1) Open Drain Output 2) 3-line Serial Control + Enable Signal 3) Internal Temperature Protection Circuit (TSD) 4) Cascade Connection Compatible 5) SSOP-B20W 6) Internal 12ch Power Transistor
Applications These ICs can be used with car and consumer electronic.
Absolute Maximum Ratings (Ta=25) Item Power Supply Voltage Output VoltagePin No : 49, 1116 Input VoltagePin No : 1, 2, 3, 17, 18 Power Dissipation Operating Temperature Range Storage Temperature Range Drive Current (DC) Drive CurrentPulse Junction Temperature Symbol VCC VDmax VIN Pd Topr Tstg IomaxD IomaxP Tjmax Value 7 35 -0.3VCC 1187* -40+105 -55+150 50 150** 150 Unit V V V mW mA mA
* Pd decreased at 9.50mW/ for temperatures above Ta=25,mounted on 70x70x1.6mm Glass-epoxy PCB. ** Do not however exceed Pd. Time to impress200msec
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1/12
2009.07 - Rev.B
BD8105FV
Operational Conditions (Ta=-40~105) Item Power Supply Voltage Drive Current Symbol Vcc Io Standard Value Min 4.5 Typ 5 20 Max 5.5 40 Unit V mA
Technical Note
* This product is not designed for protection against radioactive rays.
Electrical Characteristics (Unless specified, Ta=-40~105 Vcc=4.55.5V) Item Symbol Standard Value Min Typ Max Unit Conditions
Output D0D11 Pin No : 49, 1116 ON Resistor Output leakage current RON IDL 6 0 12 5 uA ID=20mA VD=34V
Logic input Pin No : 1, 2, 3, 17, 18 Upper limit threshold voltage Bottom limit threshold voltage Serial clock frequency Input Current Input leakage Current WHOLE Circuit Current ICC 0.3 5 mA Serial Data Input, VCC=5V,CLK=500KHz, SEROUT=OPEN RST_B=OPEN, SEROUT=OPEN VTH VTL FCLK IIN IINL Vcc x0.8 20 50 0 Vcc x0.2 1 100 5 V V MHz uA uA VIN=5V VIN=0V
Static Current SER OUT(Pin No. : 20) Output Voltage high Output voltage Low
ISTN
-
0
50
uA
VOH VOL
4.6 -
4.8 0.2
0.4
V V
VCC=5V, ISO=-5mA VCC=5V, ISO=5mA
* This product is not designed for protection against radioactive rays.
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2/12
2009.07 - Rev.B
BD8105FV
Electrical Characteristic Diagrams (Unless otherwise specified Ta=25)
250 25
230
Technical Note
10 OUTPUT RESISTANCERON[]
5.5V
SUPPLY CURRENTIcc[A]
SUPPLY CURRENTIcc[A]
9 8 7 6 5 4 3 2 1 -40 25 105
200
225
5.0V
150
220
105 -40
4.5V
215
100
50
210
0 0 1 2 3 4 SUPPLY VOLTAGEVcc[V] 5
205 -40 -15 10 35 60 85 AMBIENT TEMPERATURE Ta[]
0 4.5 4.7 4.9 5.1 5.3 SUPPLYVOLTAGEVcc[V] 5.5
Fig.1 Circuit current 1
8 OUTPUT ON RESISTANCE RON[] 7 6 5 4 3 2 1 0 -40 -15 10 35 60 85
6.0 OUTPUT ON RESISTANCE RON[ ] 5.8
Fig.2 Circuit current 2
Fig.3 Dxx on resistance 1 (at IDD=20mA)
5.4 OUTPUT VOLTAGE VOH[V]
4.5V 5V
5.6 5.4 5.2 5.0 4.8 4.6 4.4 4.2 4.0 10
4.5V 5V 5.5V
5.2 5.0 4.8 4.6 4.4 4.2 4.0
-40
5.5V
25 105
20
30
40
50
4.5
AMBIENT TEMPERATURE Ta[]
INPUT CURRENT ID[mA]
4.7 4.9 5.1 5.3 SUPPLY VOLTAGE Vcc[V]
5.5
Fig.4 Dxx on resistance 2 (at IDD=20mA)
6.0
Fig.5 Dxx on resistance
Fig.6 SEROUT high side voltage 1 (at ISO=-5mA)
0.35
0.35
5.5V
OUTPUT VOLTAGE VOH[V] 5.5
0.30 OUTPUT VOLTAGE VOL[V] 0.25 0.20 0.15 0.10 0.05 0.00
105
OUTPUT VOLTAGE VOL[V]
0.30
4.5V
0.25 0.20 0.15 0.10 0.05 0.00
5.0 4.5 4.0 3.5 3.0 -40 -15 10 35
5V 4.5V
25
-40
5V
5.5V
60
85
4.5
4.7
4.9
5.1
5.3
5.5
-40
AMBIENT TEMPERATURE Ta[]
SUPPLY VOLTAGE Vcc[V]
-15 10 35 60 85 AMBIENT TEMPERATURE Ta[]
Fig.7 SEROUT high side voltage 2 (at ISO=-5mA)
Fig.8 SEROUT low side voltage 1 (at ISO=5mA)
Fig.9 SEROUT low side voltage 2 (at ISO=5mA)
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3/12
2009.07 - Rev.B
BD8105FV
Block Diagram
Technical Note
SDWN
3
TSD
4 5 6 7
D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
<11:0>
17 1 18 2
8
SERIN LATCH CLK RST_B
Driver Serial I/F
9 11 12
<11:0> <11:0>
<11:0>
13 14 15 16
VCC
19 10
SEROUT
GND
SEROUT
20
Fig.10
Pin Setup Diagram BD8105FVSSOP-B20W
Terminal NumberTerminal Name Pin Number 1 Terminal Name LATCH RST_B SDWN D11 D10 D9 D8 D7 D6 GND D5 D4 D3 D2 D1 D0 SERIN CLK VCC SEROUT Function Latch Signal Input Terminal H: Latches Data Reset Reversal Input Terminal L: FF Data 0 Shutdown Input Terminal H: Output Off Drain Output Terminal 11 Drain Output Terminal 10 Drain Output Terminal 9 Drain Output Terminal 8 Drain Output Terminal 7 Drain Output Terminal 6 Ground Terminal Drain Output Terminal 5 Drain Output Terminal 4 Drain Output Terminal 3 Drain Output Terminal 2 Drain Output Terminal 1 Drain Output Terminal 0 Serial Data Input Terminal Clock Input Terminal
Supply Voltage Input Terminal
LATCH RST_B SDWN D11 D10 D9 D8 D7 D6
1 2 3 4 5 6 7 8 9
20 19 18 17 16 15 14 13 12 11
SEROUT VCC CLK SERIN D0 D1 D2 D3 D4 D5 2 3 4 5 6 7 8 9 10 11 12 13 14
GND 10
Fig.11
15 16 17 18 19 20
Serial Data Output Terminal
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4/12
2009.07 - Rev.B
BD8105FV
Block Operation 1Serial I/F The I/F is a 3-line serial (LATCH, CLK, SERIN) style. 12-bit output ON/OFF can be set-up. This is composed of shift register. + 12-bit register. 2Driver It is a 12-bit open drain output.
Technical Note
3TSD (Thermal Shut Down) To prevent heat damage and overheating, when the chip temperature goes over approximately 175, the output turns off. When the temperature goes back down, normal operation resumes. However, the intended use of the temperature protection circuit is to protect the IC, so please construct thermal design with the junction temperature Tjmax under 150.
Application Circuit
VCC
10uF
VBAT
10uF
IF
Rres VF
VCC SDWN LATCH RST_B CLK SERIN SEROUT GND D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11
Microcomputer
VCC
10uF
VCC SDWN LATCH RST_B CLK SERIN SEROUT GND
D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11
IF= Fig.12
VBAT - VF Rres + RON
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5/12
2009.07 - Rev.B
BD8105FV
Technical Note
Serial Communication The serial I/F is composed of a shift register which changes the CLK and SERIN serial signals to parallel signals, and a register to remember those signals with a LATCH signal. The registers are reset by applying a voltage under VCCx0.2 to the RST_B terminal or opening it, and D11~D0 become open. To prevent erroneous LED lighting, please apply voltage under VCCx0.2 to RST_B or make it open during start-up.
CLK
SERIN
Shift Register
12bit
12bit
Driver Register
LATCH
Fig.13 1Serial Communication Timing The 12-bit serial data input from SERIN is taken into the shift register by the rise edge of the CLK signal, and is recorded in the register by the rise edge of the LATCH signal. The recorded data is valid until the next rise edge of the LATCH signal. 2Serial Communication Data The serial data input configuration of SERIN terminal is shown below: First Last d11 d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 Data Terminal Name Output Status Data d8 * * * * * * 1 0 * * * * * * * * * * * * * * * * d7 * * * * * * * * 1 0 * * * * * * * * * * * * * * d6 * * * * * * * * * * 1 0 * * * * * * * * * * * * d5 * * * * * * * * * * * * 1 0 * * * * * * * * * * d4 * * * * * * * * * * * * * * 1 0 * * * * * * * * d3 * * * * * * * * * * * * * * * * 1 0 * * * * * * d2 * * * * * * * * * * * * * * * * * * 1 0 * * * * d1 * * * * * * * * * * * * * * * * * * * * 1 0 * * d0 * * * * * * * * * * * * * * * * * * * * * * 1 0
d11 d10 d9 ON 1 * * D11 OFF 0 * * ON * 1 * D10 OFF * 0 * ON * * 1 D9 OFF * * 0 ON * * * D8 OFF * * * ON * * * D7 OFF * * * ON * * * D6 OFF * * * ON * * * D5 OFF * * * ON * * * D4 OFF * * * ON * * * D3 OFF * * * ON * * * D2 OFF * * * ON * * * D1 OFF * * * ON * * * D0 OFF * * * * represents "Don't care".
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6/12
2009.07 - Rev.B
BD8105FV
Technical Note
3Enable Signal By applying voltage at least VCCx0.8 or more to the SDWN terminal, D0 (16 pin)~D11 (4 pin) become open forcibly. At this time, the temperature protection circuit (TSD) stops. D11D0 become PWM operation by inputting PWM to SDWN(3 pin). 4SEROUT A cascade connection can be made (connecting at least 2 or more IC's in serial). Serial signal input from SERIN is transferred into receiver IC by the fall edge of the CLK signal. Since this functionality gives enough margins for the setup time prior to the rise edge of the CLK signal on the receiver IC (using the exact same CLK signal of sender IC), the application reliability can be improved as cascade connection functionality.
LATCH SERIN CLK SEROUT
d11 d10 1 2 d9 3 d8 4 d7 5 d6 6 d5 d4 d3 d2 10 d1 11 d0 12
7
8
9
13
D11
Fig.14
Cascade Connection By using (at least) 2 ICs, each IC's D11~D0, at (at least) 24ch, can be controlled by the 24-bit SERIN signal. The serial data input to the sender IC can be transferred to the receiver IC by inputting 12CLK to the CLK terminal.
Send side IC
LATCH SERIN CLK
d23 d22 d21 d20 1 2 3 4 d19 d18 d17 5 6 7 d16 d15 d14 d13 8 9 10 11 d12 d11 d10 12 13 14 d9 15 d8 16
Receive side IC
d7 17
d6 18
d5
d4
d3
d2 22
d1 23
d0 24
19
20
21
Fig.15
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7/12
2009.07 - Rev.B
BD8105FV
Technical Note
INPUT SIGNAL'S TIMING CHART
TCK
CLK
50% TCKH TSEST TSEHD TCKL
SERIN
50% TLADZ TLAH
TSEW
LATCH
50%
Fig.16
INPUT SIGNAL'S TIMING RULETa=-40105 Vcc=4.55.5V Parameter CLK period CLK high pulse width CLK low pulse width SERIN high and low pulse width SERIN setup time prior to CLK rise SERIN hold time after CLK fall LATCH high pulse time Last CLK rise to LATCH rise Symbol TCK TCKH TCKL TSEW TSEST TSEHD TLAH TLADZ Min 1000 480 480 980 150 150 480 250 Unit ns ns ns ns ns ns ns ns
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8/12
2009.07 - Rev.B
BD8105FV
Technical Note
OUTPUT SIGNAL'S DELAY CHART
SDWN
50% TDSNH TDSNL
OUTPUT (D11D0)
50%
LATCH
50% TDLAH
OUTPUT (D11D0)
50%
CLK
50%
TDSOH
SEROUT
TDSOL 50%
Fig.17
OUTPUT SIGNAL'S DELAY TIMETa=-40105 Vcc=4.55.5V Parameter SDWN Switching Time(LH) SDWN Switching Time(HL) LATCH Switching Delay Time SEROUT Propagation Delay Time(LH) SEROUT Propagation Delay Time (HL) Symbol TDSNH TDSNL TDLAH TDSOH TDSOL Max 300 300 300 350 350 Unit ns ns ns ns ns
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9/12
2009.07 - Rev.B
BD8105FV
Technical Note
INPUT/OUTPUT EQUIVALENT CIRCUITPIN NAME 1PINLATCH 2PINRST_B 3PINSDWN 17PINSERIN 18PINCLK
VCC
4PIND11 5PIND10 6PIND9 7PIND8 8PIND7 9PIND6 11PIND5 12PIND4 13PIND3 14PIND2 15PIND1 16PIND0
20PINSEROUT
VCC
VCC
100k (TYP)
Fig.18
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10/12
2009.07 - Rev.B
BD8105FV
Technical Note
Operation Notes (1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. (2) Reverse connection of a power supply connector If the connector of power is wrong connected, it may result in IC breakage. In order to prevent the breakage from the wrong connection, the diode should be connected between external power and the power terminal of IC as protection solution. (3) GND potential Ensure a minimum GND pin potential in all operating conditions. (4) Setting of heat Use a setting of heat that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. (5) Pin short and mistake fitting Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC damage. (6) Actions in strong magnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. (7) Thermal shutdown circuit(TSD) This IC built-in a Thermal shutdown circuit (TSD circuit). If Chip temperature becomes 175 (TYP.), make the output an Open state. Eventually, warmly clearing the circuit is decided by the condition of whether the heat excesses over the assigned limit, resulting the cutoff of the circuit of IC, and not by the purpose of preventing and ensuring the IC. Therefore, the warm switch-off should not be applied in the premise of continuous employing and operation after the circuit is switched on. (8) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure, and use similar caution when transporting or storing the IC. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process (9) IC terminal input This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of parasitic elements. For example, when a resistor and transistor are connected to pins. (See the chart below.) the P/N junction functions as a parasitic diode when GND > (Pin A) for the resistor or GND > (Pin B) for the transistor (NPN). Similarly, when GND > (Pin B) for the transistor (NPN), the parasitic diode described above combines with the N layer of other adjacent elements to operate as a parasitic NPN transistor. The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result of the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will trigger the operation of parasitic elements, such as by the application of voltages lower than the GND (PCB) voltage to input pins.
Resistor (Pin A) (Pin B) C Transistor (NPN) (Pin B) B C E GND Parasitic elements N (Pin A) Parasitic elements

B
GND P+ N N P N Parasitic elements GND Parasitic elements N P N P+ P+ N P substrate GND P P+

E
GND (10) Ground wiring patterns When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring patterns of any external components.
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11/12
2009.07 - Rev.B

BD8105FV
Selecting a Model Name When Ordering
Technical Note
B
D
8
1
0
5
F
V
E
2
ROHM model
Part number
Package type FV : SSOP-B20W
E2 = Reel-wound embossed taping
SSOP-B20W
6.5 0.2
20 11

Tape Quantity Embossed carrier tape 2000pcs E2
The direction is the 1pin of product is at the upper left when you hold
8.1 0.3
6.1 0.2
Direction of feed
0.3Min.
( reel on the left hand and you pull out the tape on the right hand
)
1
10
1.7 0.2
0.15 0.1
0.11
0.1 0.65 0.22 0.1
1pin
Direction of feed
(Unit : mm)
Reel
Order quantity needs to be multiple of the minimum quantity.
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12/12
2009.07 - Rev.B
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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